Slit Coating Ancillary Products

Tlhaloso e Khutšoanyane:

Litšobotsi tsa ts'ebetso: 0.01um Ho nepahala ha ho khutla ha lenonyeletso la 0.01um slit die head jumper le ka har'a 1 micron

0.02um Mamello ea ho matha ea ho roala ka morao ke 2μm, 'me ho otloloha ke 0.002μm / m.

0.002um/m Ho otloloha ha molomo oa hlooho ea lekhalo ke 0.002μm/m


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

1

Litšobotsi tsa Ts'ebetso:0.01um Ho nepahala ha ho khutla ha lenonyeletso la 0.01um slit die head jumper le ka har'a micron e le 1.

0.02um Mamello ea ho matha ea ho roala ka morao ke 2μm, 'me ho otloloha ke 0.002μm / m.

0.002um/m Ho otloloha ha molomo oa hlooho ea sekoti ke 0.002μm/m.

Sebaka sa Kopo:

Ho roala ha semiconductor photoresist, ho roala ka dielectric, le ho roala filimi indastering ea lisebelisoa tsa elektroniki

Ho roala lisebelisoa tsa elektrode tse ntle le tse mpe le ho roala li-electrode tsa betri indastering e ncha ea matla

2

Litšobotsi tsa Ts'ebetso:

Phoso ea botenya ba ho roala e laoloa ka hare ho ± 3um

ho lokisa li-screw bakeng sa ho lokisa habonolo

poleiti ea phallo ea phallo, e nang le khanyetso e tlase ea moea, lebelo le ts'oanang la moea, le ho nepahala ho fihla ho 98%

Sebaka sa Kopo:

Ho nosetsa le ho omisa liboto tsa potoloho ea elektroniki (PCB) le lipontšo tsa kristale tsa metsi (LCD/TFT)

Ho hloekisa likhalase (LCD), ho hloekisa ka ultrasonic, ho ntša metsi le ho omisa

Moea o chesang o fokang indastering ea masela

3

Litšobotsi tsa Ts'ebetso:

Mamello ea Cylindricity ≤0.002mm

Mamello ea Coaxiality ≤0.002mm

Bokhopo bo Bokaholimo Ra≤0.05um

Sebaka sa Kopo:

Ho roala filimi e sireletsang bakeng sa lipontšo tsa mohala / tablet le lisebelisoa tsa electrode bakeng sa libeteri tsa lithium indastering ea lisebelisoa tsa elektroniki.

Ho roala filimi e sireletsang bakeng sa 'mele ea likoloi

Ho etsa lihlahisoa tsa photovoltaic bakeng sa libeteri tsa perovskite le dae - lisele tse matla tsa letsatsi.


  • E fetileng:
  • E 'ngoe:

  • Ngola molaetsa wa hao mona mme o re romele wona